Methods for applying a soil treatment beneath the surface of the ground
US10420332B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2018 |
| Grant date | Sep 24, 2019 |
| Priority date | — |
| Expiry date | May 9, 2038 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA01M25/006
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
In a method for treating soil at a work site, a first pressure application tool is connected to a base unit and moved relative thereto along a first area of the work site adjacent a structure and operated to inject soil treatment down into the soil along the first area of the work site. A second pressure application tool is interchanged with the first pressure application tool and moved relative to the base unit along a second area of the work site adjacent the structure and different from the first area of the work site. The second pressure application tool is operated to apply soil treatment to the soil along the second area of the work site.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.