High quality, void and inclusion free alloy wire
US10421161B2 · kind B2 · utility
0Cited by
4References
17Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 24, 2017 |
| Grant date | Sep 24, 2019 |
| Priority date | — |
| Expiry date | Jan 20, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Disclosed herein is a method of forming an alloy material for use in a wire. The method includes forming a master alloy containing lead and silver; and creating a molten wire alloy by combining the master alloy, additional lead, and a third material in a vessel. The method also includes flowing argon gas through and over the molten wire alloy. The method also includes drawing the molten alloy from the vessel through an actively cooled die, and solidifying the molten wire alloy to form a bar of wire alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.