Patent · US Active

Method and device for cleaving wafers

US10421208B2 · kind B2 · utility

0Cited by

0References

24Claims

0Family size

Assignee

SUNPOWER CORPORATION · US

Inventors

Nathan Stoddard · Beaverton, US
Bjoern Seipel · Florstadt, DE

Key dates

Filing date	Mar 12, 2013
Grant date	Sep 24, 2019
Priority date	—
Expiry date	Dec 23, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T225/12
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method for cleaving wafers comprising the following steps: providing a slice of a crystalline material with at least a first plane side, providing at least one stressing means to be attached to said slice, wherein said at least one stressing means is at least in parts made of a material with a coefficient of thermal expansion different from that of the slice, attaching said stressing means to said first plane side of said slice to form a stack, inducing a thermal shear stress to said slice by applying a temperature change to said stack.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.