Stream flow sparger for electroless nickel plating
US10422039B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2016 |
| Grant date | Sep 24, 2019 |
| Priority date | — |
| Expiry date | May 20, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/1669
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Systems and methods for nickel plating include providing a tank that retains a plating bath into which a substrate is submerged, and creating a horizontal flow of processing solution in the plating bath to assist in carrying contaminants out of the plating bath. A sparger box may be positioned in the tank to deliver the processing solution into the plating bath in a horizontal direction. The processing solution, which carries the contaminants, may exit the plating bath through a plate member that includes a plurality of orifices and is also positioned in the tank. The orifices may have a variable opening size to help control outflow of the processing solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.