Joint tape embedding apparatus, system, and method
US10422144B2 · kind B2 · utility
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17References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 2, 2017 |
| Grant date | Sep 24, 2019 |
| Priority date | — |
| Expiry date | Dec 27, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1788
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A joint tape embedding apparatus configured to determine the bonding and/or “feel” of embedding joint tape into a dry wall or wall board joint using a particular joint compound. The joint embedding apparatus is configured to allow the same user or different users to accurately repeat the determination of the bonding and/or “feel” attributes of the joint compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.