Substrate embedded time of flight sensor packaging
US10422877B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 3, 2016 |
| Grant date | Sep 24, 2019 |
| Priority date | — |
| Expiry date | Aug 4, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/933
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed herein is an electronic device having a substrate, and an integrated circuit disposed within the substrate and having a top surface. The integrated circuit may be a laser emitting integrated circuit or a reflected light detector. A first interconnect layer is formed on the top surface of the substrate. A first optically transparent layer is formed on the top surface of the substrate and covering the top surface of the integrated circuit. A second interconnect layer is formed on a top surface of the first optically transparent layer. The second interconnect layer is patterned so as to not obstruct light traveling to or from the top surface of the integrated circuit through the first optically transparent layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.