Optical semiconductor chip, corresponding arrangement, apparatus and method
US10422968B2 · kind B2 · utility
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1References
23Claims
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Key dates
| Filing date | May 22, 2018 |
| Grant date | Sep 24, 2019 |
| Priority date | — |
| Expiry date | May 22, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12147
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A semiconductor chip provides an optical medium for light propagation. The semiconductor chip includes a chip surface with an outer perimeter and a cavity in the chip surface. The cavity includes a peripheral wall and a bottom surface surrounded by the peripheral wall, the bottom surface adiabatically couplable to an optical waveguide. The cavity is located at an area of the chip surface spaced from the outer perimeter thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.