Water soluble photosensitive resin composition and film using same
US10423069B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2017 |
| Grant date | Sep 24, 2019 |
| Priority date | — |
| Expiry date | Dec 27, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3452
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A non-toxic water soluble photosensitive resin composition able to function as a solder mask coating comprises a polymer containing oxazolinyl, a photosensitive monomer, and a photo-initiator. These elements are all water soluble or water dispersible. The polymer containing oxazolinyl and the photosensitive monomer have a plurality of carbon-carbon double bonds. The polymer containing oxazolinyl and the photosensitive monomer are polymerized to form a dense cross-linking network structure when the water soluble photosensitive resin composition is exposed to ultraviolet radiation. A film using the water soluble photosensitive resin composition is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.