Dynamic thermal platform operating point for electronic devices
US10423199B2 · kind B2 · utility
0Cited by
13References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2017 |
| Grant date | Sep 24, 2019 |
| Priority date | — |
| Expiry date | Aug 1, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/206
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In one example a electronic device comprises a housing, at least one heat generating component disposed within the housing, at least one internal heat dissipation device positioned proximate the at least one heat generating component, and a thermal interface defined in at least a portion of the housing to allow direct thermal contact between the heat dissipation device and an external heat dissipation device. Other examples may be described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.