Manufacturing process of elemental chip
US10424486B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 22, 2017 |
| Grant date | Sep 24, 2019 |
| Priority date | — |
| Expiry date | Aug 22, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/6834
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing process of an elemental chip comprises steps of preparing a substrate held on the holding tape, the substrate including first and second sides opposite each other and the second side thereof being held on the holding tape, and the substrate further including a plurality of element regions and a plurality of segmentation regions defining each of the element regions; spraying a resist solution to form droplets of the resist solution, the resist solution containing a resist constituent and a solvent; forming a resist layer by vaporizing the solvent from the droplets and depositing the resist constituent on the first side of the substrate that is held on the holding tape; patterning the resist layer to expose the first side of the substrate in the segmentation regions; and plasma-etching the first side of the substrate exposed in the segmentation regions thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.