Electronic device and method of manufacturing electronic device
US10424501B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 9, 2016 |
| Grant date | Sep 24, 2019 |
| Priority date | — |
| Expiry date | Mar 9, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an electronic device includes: in transferring one or a plurality of element sections onto a first substrate from a second substrate, forming part or all of the one or the plurality of element sections on the second substrate with a resin layer in between; peeling off the one or the plurality of element sections that are formed on the second substrate from the second substrate through laser irradiation performed on the resin layer, and disposing, onto the first substrate, the one or the plurality of element sections peeled off; and using, as the resin layer, resin having glass-transition temperature and thermal decomposition temperature that differ from each other by 150 degrees centigrade or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.