Superconducting device with at least one enclosure
US10424711B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2014 |
| Grant date | Sep 24, 2019 |
| Priority date | — |
| Expiry date | Dec 18, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N60/12
Abstract
Some embodiments are directed to a device including multiple substrates comprising one or more troughs. The substrates are disposed such that the one or more troughs form at least one enclosure. At least one superconducting layer covers at least a portion of the at least one enclosure. Other embodiments are directed to a method for manufacturing a superconducting device. The method includes acts of forming at least one trough in at least a first substrate; covering at least a portion of the first substrate with a superconducting material; covering at least a portion of a second substrate with the superconducting material; and bonding the first substrate and the second substrate to form at least one enclosure comprising the at least one trough and the superconducting material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.