Integrated card-guide adapter heat sink
US10426054B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2018 |
| Grant date | Sep 24, 2019 |
| Priority date | — |
| Expiry date | Dec 12, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20509
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated adapter configured to hold two first circuit card assemblies in a larger second circuit card assembly space includes a thermally-conductive frame and two vertical thermally-conductive guide rails in the inboard region of the frame front. A channel is formed in each of the two guide rails, extending from the guide rail top to the guide rail bottom on the respective outboard side, thereby defining a front rail and a back rail, each configured to receive and support an edge of a first circuit card assembly, and the frame is configured to be attached to a second circuit card assembly, thereby forming an integrated adapter circuit card. Various circuit card sizes can be adapted for use, including supporting two 3U circuit cards in a 6U circuit card space. A method of making the integrated adapter is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.