Systems and methods for sealing a plurality of reservoirs of a microchip element with a sealing grid
US10427153B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 19, 2016 |
| Grant date | Oct 1, 2019 |
| Priority date | — |
| Expiry date | Aug 29, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
Systems and methods for sealing a plurality of reservoirs of a microchip element with a sealing grid are provided. For example, in one embodiment, a microchip element comprises a primary substrate having a plurality of reservoirs defined therein. The microchip element also includes a single continuous sealing groove defined in the primary substrate that extends around each of the plurality of reservoirs. In addition, the microchip element includes a sealing substrate comprising a single continuous sealing protrusion extending therefrom. The single continuous sealing protrusion corresponds to and is configured to mate with the single continuous sealing groove to form a hermetic bond between the primary substrate and the sealing substrate. In this manner, the single continuous sealing groove and the single continuous sealing protrusion form a sealing grid about the plurality of reservoirs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.