Semiconductor manufacturing device with embedded fluid conduits

US10427217B2 · kind B2 · utility

Assignee

• Varian Semiconductor Equipment Associates, Inc. · US

Inventors

• Joshua Abeshaus · Haverhill, US
• Jordan B. Tye · Arlington, US

Key dates

• Filing date: Apr 21, 2015
• Grant date: Oct 1, 2019
• Expiry date: Feb 12, 2037

Classification

• Technology area (CPC —): General

Abstract

Provided herein are approaches for forming a conduit embedded within a component of a semiconductor manufacturing device (e.g., an ion implanter) using an additive manufacturing process (e.g., 3-D printing), wherein the conduit is configured to deliver a fluid throughout the component to provide heating, cooling, and gas distribution thereof. In one approach, the conduit includes a set of raised surface features formed on an inner surface of the conduit for varying fluid flow characteristics within the conduit. In another approach, the conduit may be formed in a helical configuration. In another approach, the conduit is formed with a polygonal cross section. In another approach, the component of the ion implanter includes at least one of an ion source, a plasma flood gun, a cooling plate, a platen, and/or an arc chamber base.