Patent · US Active

Devices and methods for monitoring, in particular for regulating, a cutting process

US10427242B2 · kind B2 · utility

3Cited by

2References

13Claims

0Family size

Assignee

TRUMPF Werkzeugmaschinen GmbH + Co. KG · DE

Inventors

Boris Regaard · Gerlingen, DE
David Schindhelm · Stuttgart, DE

Key dates

Filing date	Mar 11, 2016
Grant date	Oct 1, 2019
Priority date	—
Expiry date	Aug 19, 2037

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K31/125
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

The invention relates to devices and methods for monitoring or regulating a cutting process on a workpiece. A focusing element focuses a high-energy beam onto the workpiece. An image capture apparatus captures a region at the workpiece to be monitored. The region includes an interaction region of the high-energy beam with the workpiece. An evaluation apparatus determines at least one characteristic variable of the cutting process, in particular of a kerf formed during the cutting process, on the basis of the captured interaction region.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.