Method for curing resin composition
US10427394B2 · kind B2 · utility
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7Claims
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Key dates
| Filing date | Nov 6, 2014 |
| Grant date | Oct 1, 2019 |
| Priority date | — |
| Expiry date | Mar 28, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2003/2265
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a method with which curing can be carried out in a short time without a heat load on an adherend and a cured product having stable quality can be obtained. The resin composition curing method in accordance with the present invention includes the step (a) of directly and/or indirectly irradiating, with laser light, a resin composition (A) which contains (i) an epoxy resin, (ii) an encapsulated curing agent including a core that contains a curing agent and a shell that covers the core, (iii) a filler, and (iv) a color material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.