Package with heat score
US10427851B2 · kind B2 · utility
4Cited by
38References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2011 |
| Grant date | Oct 1, 2019 |
| Priority date | — |
| Expiry date | Jun 5, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D2575/586
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The present invention addresses certain problems facing flexible packages and the packaging industry. Embodiments of the present invention are directed to a method of heat scoring the film or material of the package in various shapes and locations to facilitate the consumer opening the package. Embodiments are also directed to a heat scoring device for delivering the heat score to the package material during the manufacturing process. Other embodiments are directed to a package having one or more heat scores for permitting a user to easily access the contents of a package while maintaining the integrity of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.