Method for cutting glass
US10427968B2 · kind B2 · utility
2Cited by
9References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2017 |
| Grant date | Oct 1, 2019 |
| Priority date | — |
| Expiry date | Feb 11, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C2218/355
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method for cutting glass is disclosed. A glass substrate is provided, the glass substrate includes at least one cutting surface, some micro-fractures are formed on the cutting surface. A conductivity material is provided and coated on the cutting surface to form a conductivity material layer. The conductivity material layer can absorb laser energy. The conductivity material layer is irradiated by laser. The glass substrate adjoined to the cutting surface is fused to repair the micro-fractures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.