Compositions, materials, and methods for enhancing 3D printer platform adhesion and/or reducing warpage in printed parts
US10428248B1 · kind B1 · utility
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8Claims
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Assignee
Inventors
Key dates
| Filing date | Oct 11, 2016 |
| Grant date | Oct 1, 2019 |
| Priority date | — |
| Expiry date | Apr 1, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J189/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed herein are adhesive compositions for coating the print-bed of a 3D printer print platform. The compositions comprise a polyelectrolyte or mixture of polyelectrolytes with different additives and preservatives in a solvent. Also disclosed herein are methods of manufacturing the adhesive compositions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.