Integrated circuit authentication from a die material measurement
US10429438B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2016 |
| Grant date | Oct 1, 2019 |
| Priority date | — |
| Expiry date | Sep 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/5444
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The various technologies presented herein relate to measuring a signal generated by a die-based test circuit incorporated into an IC, and utilizing the measured signal to authenticate the IC. The signal can be based upon a sensor response generated by the test circuit fabricated into the die, wherein the sensor response is based upon a property of the die material. The signal can be compared with a reference value obtained from one or more test circuit(s) respectively located on one or more reference dies, wherein the reference dies are respectively cut from different wafers, and the location at which the reference dies were cut is known. If the measured signal matches the reference value, the die is deemed to be from the same cut location as the dies from which the reference value was obtained. If the measured signal does not match the reference value, the die is not authenticated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.