Method for fabricating array substrate, array substrate and display device
US10429698B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 10, 2017 |
| Grant date | Oct 1, 2019 |
| Priority date | — |
| Expiry date | Aug 10, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/133397
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present disclosure discloses a method for fabricating an array substrate, including: providing a base substrate which includes a transparent substrate, a data electrode pattern layer formed on the transparent substrate, and an insulation layer covering the data electrode pattern layer, the data electrode pattern layer comprising at least one data electrode; forming a via-hole penetrating through the insulation layer so as to expose at least a part of one of the at least one data electrode; forming a transparent electrode material layer; forming a transparent electrode layer which includes a transparent electrode and a connecting portion connected to the transparent electrode, the connecting portion being located in the via-hole so as to electrically connect the transparent electrode with a corresponding data electrode, and a filling being provided above the connecting portion. The present disclosure also discloses an array substrate and a display device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.