Panel and manufacturing method thereof
US10429976B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 23, 2017 |
| Grant date | Oct 1, 2019 |
| Priority date | — |
| Expiry date | Oct 23, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04111
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a panel is provided, including forming a first conductive pattern including a first portion and a second portion, forming a second conductive pattern connecting between the first portion and the second portion, and thermally treating a mask pattern of an insulation material to form an insulation pattern substantially covering a side surface of the second conductive pattern. A panel manufactured by using the foregoing method is also provided. A horizontal distance between an outer side surface of the insulation pattern and an inner side surface adjacent to the second conductive pattern is less than 3 micrometers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.