Methods and systems for root cause analysis for assembly lines using path tracking
US10430269B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2017 |
| Grant date | Oct 1, 2019 |
| Priority date | — |
| Expiry date | Dec 8, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F11/079
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Methods and systems for performing root cause analysis for an assembly line including a plurality of nodes using path tracking. One method includes receiving tracking data identifying a subset of the plurality of nodes processing a product produced by the assembly line and receiving approval data associated with the assembly line identifying whether each product produced by the assembly line fails an approval metric. The method also includes enumerating a plurality of paths through the assembly line based on the tracking data and determining a failure rate for each of the plurality of paths based on the approval data. In addition, the method includes identifying a malfunctioning path included in the plurality of paths based on the failure rate for each of the plurality of paths, identifying a malfunctioning node based on the malfunctioning path, and performing an automatic action to address the malfunctioning node.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.