Fan-out sensor package and camera module including the same
US10431615B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2017 |
| Grant date | Oct 1, 2019 |
| Priority date | — |
| Expiry date | Mar 3, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A fan-out sensor package includes: a first interconnection member having a through-hole; a sensor disposed in the through-hole of the first interconnection member and having an active surface having connection pads and microlenses disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the active surface or the inactive surface of the sensor; and a second interconnection member disposed on the first interconnection member and the inactive surface or the active surface of the sensor. The first interconnection member and the second interconnection member include, respectively, redistribution layers electrically connected to the connection pads of the sensor. A camera module includes the fan-out sensor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.