Semiconductor device
US10431649B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2018 |
| Grant date | Oct 1, 2019 |
| Priority date | — |
| Expiry date | Jul 30, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/405
Abstract
According to one embodiment, a semiconductor device includes a first conductive portion, a first extension portion, a first conductive region, a first extension region, a semiconductor portion, and an insulating portion. The first conductive portion includes a first portion, a second portion, a third portion, a fourth portion, a fifth portion, and a sixth portion. The first extension portion is electrically connected to the first conductive portion. The first conductive region is provided between the first portion and the second portion, between the third portion and the fourth portion, and between the fifth portion and the sixth portion. The first extension region is electrically connected to the first conductive region. The semiconductor portion includes silicon carbide and includes first to third semiconductor regions. The insulating portion is provided between the first conductive portion and the semiconductor portion and between the first extension portion and the semiconductor portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.