Manufacturing method of printing circuit board with micro-radiators
US10433414B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2015 |
| Grant date | Oct 1, 2019 |
| Priority date | — |
| Expiry date | Jan 7, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10106
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a printed circuit board includes providing a substrate having at least one resin plate and a semi-cured sheet. A through hole is formed in the substrate to accommodate a radiator having an electrically conductive layer and an electrically insulated layer. The substrate and radiator are heat pressed to fully cure the epoxy and couple the substrate and radiator together. The excess resin is removed and electrically conductive layers are plated on the board. Surface circuits and a heat dissipating pattern are then etched into the conductive layer. An LED is attached to the printed circuit board. In some embodiments, a flexible segment is formed by removing a portion of the substrate. The radiator can have an electrically insulated layer extending at least partially across a surface of an electrically insulated and thermally conductive core.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.