Thermal dissipation system for wearable electronic devices
US10433467B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2017 |
| Grant date | Oct 1, 2019 |
| Priority date | — |
| Expiry date | Nov 9, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermal dissipation system for wearable electronic devices transfers heat away from a housing enclosing a heat source and dissipates the heat through a region of the support assembly that is noncontiguous with the housing. The support assembly may be coupled to the housing to enable the housing to be worn by a user. Various regions of the support assembly have different thermal resistances between a thermal conduit and an ambient environment. The thermal resistances may decrease as the thermal conduit becomes farther away from the heat source. The variations in thermal resistances enable modulation of relative heat flux between the various regions. For example, heat may be internally routed through the wearable electronic device to be dissipated through a surface that a user does not typically touch during operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.