Patent · US Active

Solder paste with oxalic acid and amine component

US10434610B2 · kind B2 · utility

0Cited by

2References

12Claims

0Family size

Assignee

HERAEUS DEUTSCHLAND GMBH & CO. KG · DE

Inventors

Jens Nachreiner · Schlüchtern, DE
Joachim Wiese · Höchst im Odenwald, DE
Sebastian Fritzsche · Hanau, DE

Key dates

Filing date	Dec 12, 2014
Grant date	Oct 8, 2019
Priority date	—
Expiry date	Apr 18, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10621
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A solder paste for the mounting of electronic components and substrates contains a mixture of oxalic acid, adipic acid, and an amine component. An electronic component may be mounted on a substrate through the use of the solder paste. Also, a module may utilize the solder paste.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.