Resin molding method
US10434694B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2017 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Jan 30, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14475
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A resin molding method includes a first molding step of molding a first molded part and a second molded part in a mold and a second molding step of joining the first molded part and the second molded part. In the first molding step, the second molded part is formed by injecting resin into an area where a first core movable in the first direction and a second core movable in a second direction are engaged. In the second molding step, the second molded part is joined to the first molded part by injecting the resin while the first core is in contact with the second molded part and the second core is removed from the second molded part. Areas where the first core and the second core are located in the first molding step become hollow areas connected to each other and part of ends of the first core in the first direction is not in contact with the second core.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.