Light emitting diode lamp assembly
US10435175B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2017 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Feb 22, 2037 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21Y2115/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A light emitting diode (LED) lamp assembly includes a base including an electrical connector adapted to electrically engage a socket. A thermally conductive enclosure is coupled to the base, and a printed circuit board is disposed within the thermally conductive enclosure. The printed circuit board is operably electrically connected with the base and the electrical connector and thermally coupled to the enclosure. An LED is disposed on an exterior surface of the housing and electrically coupled to the printed circuit board. The thermally conductive enclosure is adapted to mechanically and thermally engage the socket to sink heat generated by the printed circuit board and the light source from the lamp assembly into the socket and an associated reflector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.