Deformable apparatus and method
US10435289B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2015 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Oct 13, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus and method wherein the method comprises: a deformable substrate; a curved support structure configured to support at least a portion of a resistive sensor wherein the resistive sensor comprises a first electrode, a second electrode and a resistive sensor material provided between the electrodes; at least one support configured to space the curved support structure from the deformable substrate so that when the deformable substrate is deformed the curved support structure is not deformed in the same way; wherein the resistive sensor is positioned on the curved support structure so as to limit deformation of the resistive sensor when the deformable substrate is deformed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.