Metal plating compositions
US10435380B2 · kind B2 · utility
1Cited by
15References
2Claims
0Family size
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Inventors
Key dates
| Filing date | Oct 11, 2018 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Oct 11, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/123
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Reaction products of primary and secondary diamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.