Patent · US Active

Removable pressure-sensitive adhesive strip

US10435594B2 · kind B2 · utility

1Cited by

30References

15Claims

0Family size

Assignee

tesa SE · DE

Inventors

Anna Blazejewski · Hamburg, DE
Axel Burmeister · Hamburg, DE
Franciska LOHMANN · Hamburg, DE
Anika PETERSEN · Heidmühlen, DE

Key dates

Filing date	Mar 29, 2016
Grant date	Oct 8, 2019
Priority date	—
Expiry date	Mar 29, 2036

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09J2453/00
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

The invention relates to a pressure-sensitive adhesive strip, for the residue-free and nondestructive removal by which by substantially expanding it in the plane of adhesion, comprising an adhesive compound layer, said adhesive compound layer consisting of a pressure-sensitive adhesive compound, constituted by vinyl aromatic block copolymers and adhesive resins, at least 75 wt.-% (relative to the total amount of resin) of a resin being selected that has a DACP (diacetone alcohol cloud point) of greater than −20° C., preferably greater than 0° C., and a softening point (ring & ball) of greater than or equal to 70° C., preferably greater than or equal to 100° C., and the pressure-sensitive adhesive compound being foamed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.