Low heat transfer encapsulation for high sensitivity and low power environmental sensing applications
US10436731B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Jul 27, 2018 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Jul 27, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/0214
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A miniature gas sensing device includes a silicon-based substrate including an opening. A first membrane is formed over the silicon-based substrate and a first portion of the first membrane covers the opening. A gas sensing layer is formed over a number of electrodes disposed over a first surface of the first portion of the first membrane and one or more heating elements. A permeable enclosure encapsulating the gas sensing layer can maintain thermal energy density over the gas sensing layer at a level sufficient to destroy a target gas to allow measuring a zero baseline.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.