Patent · US Active

Modular fingertip sensors

US10437345B2 · kind B2 · utility

0Cited by

2References

20Claims

0Family size

Assignee

The Boeing Company · US

Inventors

Richard Meagher · Fairport, US
John W. Glatfelter · West Chester, US

Key dates

Filing date	Jun 30, 2017
Grant date	Oct 8, 2019
Priority date	—
Expiry date	Dec 27, 2037

Classification

Technology area (CPC G)Physics
CPC primaryG06F2203/0331
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A sensor system includes a finger mount comprising a sleeve, where the sleeve is configured to attach to a finger of a user. The system also includes a processing unit coupled to the finger mount, and a sensory attachment coupled to the finger mount, where the sensory attachment is communicatively coupled to the processing unit. The system also includes a grounding component conductively coupled to the finger mount.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.