Resistor with upper surface heat dissipation
US10438729B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2018 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Nov 5, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C9/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of upper heat dissipation elements. The plurality of heat dissipation elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of heat dissipation elements and a surface of the resistive element. Electrode layers are provided on a bottom surface of the resistive element. Solderable layers form side surfaces of the resistor and assist in thermally coupling the heat dissipation elements, the resistor and the electrode layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.