Plasma source and methods for depositing thin film coatings using plasma enhanced chemical vapor deposition
US10438777B2 · kind B2 · utility
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Key dates
| Filing date | Jan 6, 2014 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Jan 11, 2034 |
Classification
- Technology area (CPC —)General
Abstract
The present invention provides novel plasma sources useful in the thin film coating arts and methods of using the same. More specifically, the present invention provides novel linear and two dimensional plasma sources that produce linear and two dimensional plasmas, respectively, that are useful for plasma-enhanced chemical vapor deposition. The present invention also provides methods of making thin film coatings and methods of increasing the coating efficiencies of such methods.
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