Transfer printed device repair
US10438859B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2017 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Apr 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A repaired transfer printed system (e.g., micro-transfer printed system) includes a system substrate having two or more contact pads disposed on the system substrate. One or more transfer printed devices (e.g., micro-transfer printed devices) are disposed in contact with the system substrate, each device having two or more connection posts. Each connection post of a replacement device is in physical contact with a contact pad, the connection post forming a second imprint in the physically contacted contact pad. In certain embodiments, a first imprint is in at least one of the physically contacted contact pads and is between the replacement device and the system substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.