Flexible micro-module
US10438895B1 · kind B1 · utility
2Cited by
7References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 8, 2018 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Jun 8, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0665
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The described Flexible Micro-Module (FMM) is a device that is made possible by the application of ultra-thin flexible single crystalline ICs. The FMM integrates the IC(s), insulating contact substrate, vias for connections to pads, and external contacts into a single device. The thin and flexible FMM eliminates the need for wire bonds and card body cavities in smart card assemblies, and accommodates applying larger ICs to smart cards than what is possible with conventional micro-modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.