Method for manufacturing light emitting device
US10439097B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 11, 2018 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Sep 11, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8514
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a light emitting device includes: preparing an LED die having a laminated structure including a light emitting surface, an electrode forming surface, and a side surface, and at least one electrode placed on the electrode forming surface; preparing a wavelength conversion member having an upper surface defining a recess, the recess having an opening diameter greater than a diameter of the light emitting surface in a plan view; placing a light-transmissive member within the recess; mounting the LED die on an upper surface of the light-transmissive member white the light emitting surface faces the upper surface of the light-transmissive member and pressing the LED die so that at least a portion of the light-transmissive member is placed on the side surface of the laminated structure; and placing a light reflecting member to cover the LED die, the light-transmissive member, and the wavelength conversion member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.