Wireless device
US10439264B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2017 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Feb 26, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/6677
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
According to an embodiment, a wireless device includes an interposer, a semiconductor chip, and a non-conductor. The interposer comprises a plurality of conductor layers. The semiconductor chip is mounted on the interposer and comprising a built-in transceiver circuit. The non-conductor is placed on the interposer and seals the semiconductor chip. From among the plurality of conductor layers, a first conductor layer and a second conductor layer are symmetrically positioned with respect to center in a thickness direction of the interposer respectively have a first antenna conductor pattern and a second antenna conductor pattern. The first antenna conductor pattern and the second antenna conductor pattern respectively have a first opening and a second opening functioning as a slot antenna and have substantially equal area of a conductor portion. An orthogonal projection of the first opening onto the second conductor layer overlaps with the second opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.