MEMS device with large out-of-plane actuation and low-resistance interconnect and methods of use
US10439591B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2016 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Feb 2, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03J2200/39
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The present application is directed to a MEMS device. The MEMS device includes a substrate having a first end and a second end extending along a longitudinal axis, the substrate including an electrostatic actuator. The device also includes a movable plate having a first end and a second end. The device also includes a thermal actuator having a first end coupled to the first end of the substrate and a second end coupled to the first end of the plate. The actuator moves the plate in relation to the substrate. Further, the device includes a power source electrically coupled to the thermal actuator and the substrate. The application is also directed to a method for operating a MEMS device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.