Active heatsink lid
US10440811B2 · kind B2 · utility
1Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2016 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Jan 31, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An active device lid for a device base. The device lid includes a heatsink proximate to a circuit assembly and configured to remove heat generated by the device base, the circuit assembly configured to generate an operating signal voltage for the device base, and a connector configured to connect the circuit assembly to the device base, where the device base is configured to connect to a device mounting substrate on a substrate side of the device base, and where the circuit assembly is configured to be at least partially located on an opposing side of the device base, the opposing side opposing the substrate side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.