Substrate assembly, display substrate motherboard, display substrate, and production method, display
US10440820B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 26, 2017 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Sep 26, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments of this disclosure provide a substrate assembly, a display substrate motherboard, a display substrate, and a production method, and a display, and relate to the technical field of flexible display. The damage of the support substrate and the flexible base substrate upon separation may be avoided, and the bulging phenomenon of the connecting layer occurred at a high temperature may be prevented. This substrate assembly comprises a support substrate as well as a connecting layer and a flexible base substrate which are sequentially formed on the support substrate, wherein the material of the connecting layer comprises an organic layered material, and the molecule constituting the organic layered material comprises a hydrophilic group. The substrate assembly is used for producing a flexible display substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.