Patent · US Active

Chip card module and method for producing a chip card module

US10440825B2 · kind B2 · utility

3Cited by

16References

13Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Frank Pueschner · Kelheim, DE
Peter Stampka · Burglengenfeld, DE
Jens Pohl · San Luis Obispo, US
Marcus Janke · Munich, DE

Key dates

Filing date	Jun 13, 2017
Grant date	Oct 8, 2019
Priority date	—
Expiry date	Oct 6, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10719
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

In various embodiments, a chip card module is provided. The chip card module includes a chip card module contact array having six contact pads that are arranged in two rows having three contact pads each in accordance with ISO 7816, and three additional contact pads that are arranged between the two rows. Each additional contact pad is electrically conductively connected to a respective associated contact pad from a row from the two rows.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.