Heating circuit assembly and method of manufacture
US10440829B2 · kind B2 · utility
0Cited by
21References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2015 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Mar 16, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2214/04
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A heating circuit assembly and method of manufacture includes an electrically conductive heating element having a pattern. An electrically non-conductive substrate is additive manufactured and secured to the element for structural support. The substrate has a topology that generally aligns with the pattern of the element thereby reducing the assembly weight and minimizing substrate material waste.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.