Patent · US Active

Device and method for processing substrates

US10442103B2 · kind B2 · utility

3Cited by

21References

15Claims

0Family size

Assignee

KOENIG & BAUER AG · DE

Inventors

Gunar Bormann · Freital, DE
Johannes Naumann · Weinböhla, DE
Jörg Reber · Dresden, DE
Eberhard Fuchs · Bischofswerda, DE
Kay Klawitter · Dresden, DE

Key dates

Filing date	Nov 23, 2016
Grant date	Oct 15, 2019
Priority date	—
Expiry date	Nov 23, 2036

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB31B50/146
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A device for processing substrates uses a separation system. Processed substrates can be separated into one or more waste parts and at least one blank. Improved flexibility for treating substrates is provided. The separation system comprises a transport cylinder and a stripping cylinder associated therewith. The transport cylinder has first openings and has a detachably secured packing having depressions in which perforations are formed, with at least one perforation covering at least one first opening. The stripping cylinder has a detachably secured packing having raised areas that correspond to the depressions.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.