Closed loop 3D printing
US10442118B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 29, 2016 |
| Grant date | Oct 15, 2019 |
| Priority date | — |
| Expiry date | Apr 17, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/0067
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
To better control part quality of 3D printed parts, the temperature of an extruder filament using a secondary heat source is provided. A heat source, such as an infrared heat source, can be used to heat the filament of a 3D printer to the optimum temperature that will enhance welding of the filament to a substrate that it is being printed on or to. Such an optimum temperature can be based upon, in part, the temperature of the substrate. A controller or other intelligent control can be used to receive temperature readings of the substrate and/or filament and then can adjust the temperature of the heating source to optimize the temperature of the filament to better combine the filament to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.