Edge chamfering methods

US10442719B2 · kind B2 · utility

Assignee

• CORNING INCORPORATED · US

Inventors

• Sasha Marjanovic · Corning, US
• Albert Roth Nieber · Corning, US
• Garrett Andrew Piech · Corning, US
• Helmut Schillinger · Herzogenaurach, DE
• Sergio Tsuda · Horseheads, US
• Robert Stephen Wagner · Corning, US

Key dates

• Filing date: Oct 31, 2014
• Grant date: Oct 15, 2019
• Expiry date: Oct 31, 2034

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/24777
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a CO2 laser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or CO2 lasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape.